DocumentCode
2614159
Title
The Influence of Stress on Aluminum Conductor Life
Author
Turner, Timothy ; Wendel, K.
Author_Institution
Mostek Corporation, 1215 West Crosby Rd., Carrollton, bx. 75006. (214) 466-6337/466-6442
fYear
1985
fDate
31107
Firstpage
142
Lastpage
147
Abstract
Stress induced failure of Al-Si metal lines has been observed in long lines less than four microns wide. The failures result from voids or cracks in metal lines and appear very similar to electromigration induced damage. However, these failures can be generated without electrical stress, and are not accelerated by high temperatures. The failures were found to be due to a combination of Coble and Nabarro-Herring creep of the aluminum, and could be prevnted by the addition of 0.5 to 2.0 % copper in the aluminum.
Keywords
Aluminum; Conductors; Copper alloys; Creep; Etching; Glass; Metallization; Silicon; Stress; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1985. 23rd Annual
Conference_Location
Orlando, FL, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1985.362089
Filename
4208616
Link To Document