Title :
A Paradoxical Relationship between Width/Spacing of Aluminum Electrodes and Aluminum Corrosion
Author :
Wada, T. ; Higuchi, H. ; Ajiki, T.
Author_Institution :
Matsushita Electronics Corporation, QA Center Semiconductor Group 1, Kotari, Yakemachi, Nagaokakyo, Kyoto, 617 Japan Tel. 075-951-8151
Abstract :
Life tests on aluminum interconnect showed that pattern with a large width and spacing can corrode faster than those with a smaller width and spacing. This paradoxical phenomenon was found on temperature, humidity and bias test at 85 to 140°C, 85%RH, and 0 to 150V, and can be explained by crack formation in the passivation layer induced by aluminum corrosion.
Keywords :
Aluminum; Corrosion; Electrodes; Electronics packaging; Humidity; Life estimation; Plasma temperature; Plastics; Testing; Water heating;
Conference_Titel :
Reliability Physics Symposium, 1985. 23rd Annual
Conference_Location :
Orlando, FL, USA
DOI :
10.1109/IRPS.1985.362092
