DocumentCode
2614280
Title
New Filler-Induced Failure Mechanism in Plastic Encapsulated VLSI Dynamic MOS Memories
Author
Matsumoto, H. ; Yamada, M. ; Fukushima, J. ; Kondoh, T. ; Kotani, N. ; Tosa, M.
Author_Institution
Mitsubishi Electric Corporation
fYear
1985
fDate
25-29 March 1985
Firstpage
180
Lastpage
183
Abstract
Fillers in plastic resin can give the local stress to the chip, which causes a single-column-line failure in a sensitive dynamic RAM with marginal sense amplifier circuits. This failure can be improved effectively by employing fillers of small size and/or a buffer coating over the chip.
Keywords
Ceramics; Circuit testing; Failure analysis; Materials testing; Plastic packaging; Random access memory; Read-write memory; Resins; Semiconductor device packaging; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1985. 23rd Annual
Conference_Location
Orlando, FL, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1985.362095
Filename
4208622
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