Title :
Moisture Resistance Degradation of Plastic LSIs by Reflow Soldering
Author :
Fukuzawa, I. ; Ishiguro, S. ; Nanbu, S.
Author_Institution :
Electronic Devices Group, Oki Electric Industry Co., Ltd., 550-1 Higashiasakawa, Hachioji-shi Tokyo Japan, (0426) 63-1111
Abstract :
This paper presents the problems on LSIs that are mounted by reflow soldering method. The models for these problems and the evaluation method are presented. The structure and reliability data for the improved packages are presented.
Keywords :
Degradation; Glass; Heating; Large scale integration; Moisture; Packaging machines; Plastic packaging; Reflow soldering; Surface cracks; Temperature;
Conference_Titel :
Reliability Physics Symposium, 1985. 23rd Annual
Conference_Location :
Orlando, FL, USA
DOI :
10.1109/IRPS.1985.362097
