DocumentCode
2614331
Title
Moisture Resistance Degradation of Plastic LSIs by Reflow Soldering
Author
Fukuzawa, I. ; Ishiguro, S. ; Nanbu, S.
Author_Institution
Electronic Devices Group, Oki Electric Industry Co., Ltd., 550-1 Higashiasakawa, Hachioji-shi Tokyo Japan, (0426) 63-1111
fYear
1985
fDate
31107
Firstpage
192
Lastpage
197
Abstract
This paper presents the problems on LSIs that are mounted by reflow soldering method. The models for these problems and the evaluation method are presented. The structure and reliability data for the improved packages are presented.
Keywords
Degradation; Glass; Heating; Large scale integration; Moisture; Packaging machines; Plastic packaging; Reflow soldering; Surface cracks; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1985. 23rd Annual
Conference_Location
Orlando, FL, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1985.362097
Filename
4208624
Link To Document