Infrared Microscopy as Applied to Failure Analysis of P-DIP Devices

Infrared microscopy is an important tool to the failure analyst, and its uses in failure mode identification are becoming more varied and numerous. Recent advances in equipment have enabled high magnification examination with very good resolution when analyzing plastic encapsulated devices from the backside of the die. This paper will discuss various anomalies observable with this technique as well as sample preparation techniques and a description of the IR equipment used.