• DocumentCode
    2615
  • Title

    Energy Efficient and Energy Proportional Optical Interconnects for Multi-Core Processors: Driving the Need for On-Chip Sources

  • Author

    Heck, Martijn J. R. ; Bowers, John E.

  • Author_Institution
    Univ. of California, Santa Barbara, Santa Barbara, CA, USA
  • Volume
    20
  • Issue
    4
  • fYear
    2014
  • fDate
    July-Aug. 2014
  • Firstpage
    332
  • Lastpage
    343
  • Abstract
    Silicon photonics is the prime candidate technology to realize an optical network-on-chip for global interconnects in future multi-core processors. Since silicon photonics lacks efficient native-substrate optical sources, the question is whether off-chip or heterogeneously integrated on-chip sources are the preferred technology. In this paper we argue, based on arguments of energy efficiency and energy proportionality, that on-chip sources provide a dramatic overall system efficiency improvement, as compared to using an off-chip (comb) source. We estimate an increase in source efficiency for on-chip lasers of close to 20 dB. These results provide a clear case to include on-chip lasers, such as hybrid silicon lasers, into the network architecture design.
  • Keywords
    elemental semiconductors; integrated optoelectronics; network-on-chip; optical interconnections; optoelectronic devices; silicon; silicon-on-insulator; energy efficient; energy proportional optical interconnects; hybrid silicon platform; integrated optoelectronics; multicore processors; network on chip; on-chip sources; optical interconnections; optoelectronic devices; semiconductor lasers; silicon-on-insulator; Bandwidth; Integrated optics; Optical interconnections; Power lasers; Silicon; System-on-chip; Integrated optoelectronics; hybrid silicon platform; network on chip; optical interconnections; optoelectronic devices; semiconductor lasers; silicon-on-insulator (SOI) technology;
  • fLanguage
    English
  • Journal_Title
    Selected Topics in Quantum Electronics, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    1077-260X
  • Type

    jour

  • DOI
    10.1109/JSTQE.2013.2293271
  • Filename
    6676795