• DocumentCode
    2615027
  • Title

    A modular analog CMOS LSI for feedforward neural networks with on-chip BEP learning

  • Author

    Wang, Yiwen

  • Author_Institution
    Dept. of Comput. Eng., Minnesota Univ., Duluth, MN, USA
  • fYear
    1993
  • fDate
    3-6 May 1993
  • Firstpage
    2744
  • Abstract
    A modular design approach for analog CMOS implementation of a feedforward neural net with on-chip backward error propagation (BEP) learning is proposed. Two LSI prototype chips have been designed and sent for fabrication in 2.2 × 2.2 mm2 using a standard 2μm CMOS technology. The first chips integrates two 3 × 3 synapses multiplications, integrations, and storages. The synapse chips can be cascaded horizontally to increase the number of inputs per layer, and vertically to add the number of neurons per layer. The second chip integrates three variable-gain neurons with adjustable-gain sigmoidal activation function and the first derivative of the sigmoidal function. Custom VLSI layout reduces the layout area of the processing elements, which in turn increases the expected network density. The modular architecture of the circuits makes it possible to increase the size of the network by interconnecting multiple modular chips
  • Keywords
    CMOS analogue integrated circuits; analogue processing circuits; backpropagation; feedforward neural nets; large scale integration; neural chips; 2 micron; LSI; adjustable-gain sigmoidal activation function; analog CMOS implementation; backward error propagation; custom VLSI layout; expected network density; feedforward neural networks; layout area; modular design approach; multiple modular chips; on-chip BEP learning; synapse chips; synapses multiplications; variable-gain neurons; Biological neural networks; CMOS technology; Circuits; Feedforward neural networks; Large scale integration; Network-on-a-chip; Neural network hardware; Neural networks; Neurons; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 1993., ISCAS '93, 1993 IEEE International Symposium on
  • Conference_Location
    Chicago, IL
  • Print_ISBN
    0-7803-1281-3
  • Type

    conf

  • DOI
    10.1109/ISCAS.1993.394335
  • Filename
    394335