DocumentCode
2615336
Title
Reliability Comparison of Flotox and Textured-Polysilicon E2PROMs
Author
Mielke, Neal ; Fazio, Albert ; Liou, Ho-Chun
Author_Institution
Intel Corporation, 3065 Bowers Ave., Santa Clara CA 95051. (408) 987-8080
fYear
1987
fDate
31868
Firstpage
85
Lastpage
92
Abstract
The leading E2PROM technologies are FLOTOX and textured polysilicon. Both store data as charge on a floating gate, and both use electron tunneling to write this data, but the two use radically different tunnel oxides for this purpose. When tunneling is not involved, as in lifetest and data-retention tests, the two have similar reliability. This reliability can exceed that of SRAMs and DRAMs because the E2PROMs are less sensitive to low-voltage oxide breakdown and soft errors. When tunneling is involved, as in program/erase endurance, their reliability is radically different. FLOTOX´s program window is well-controlled and stable, so that failure to write is rare; endurance is instead limited by defect-related tunnel-oxide breakdown leading to data loss. Textured poly has the reverse characteristics: the window closes, but breakdown is rare. This tradeoff affects scaling, since defect-related breakdown increases directly with memory size, whereas window closing does not. FLOTOX is therefore best suited for low densities, textured-poly for high densities. Endurance evaluations must account for the differences between the technologies.
Keywords
Anodes; EPROM; Electric breakdown; Electrons; Grounding; Life testing; Nonvolatile memory; Surface texture; Tunneling; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1987. 25th Annual
Conference_Location
San Diego, CA, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1987.362160
Filename
4208694
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