DocumentCode
2615737
Title
Thin-Film Cracking and Wire Ball Shear in Plastic Dips Due to Temperature Cycle and Thermal Shock
Author
Shirley, C.G. ; Blish, R.C.
Author_Institution
Intel Corporation
fYear
1987
fDate
31868
Firstpage
238
Lastpage
249
Abstract
A test chip was used to compare thin film cracking of various circuit layouts at various positions on the chip, and to study wire ball shear. Slotted aluminum busses reduced thin film cracking in die corners. Thin film cracking and wire ball shear failure rates have remarkably different dependence on shock versus cycle and on lead frame material.
Keywords
Aluminum; Circuit testing; Electric shock; Packaging; Passivation; Plastic films; Resistors; Temperature; Thin film circuits; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1987. 25th Annual
Conference_Location
San Diego, CA, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1987.362185
Filename
4208719
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