Title :
Thin-Film Cracking and Wire Ball Shear in Plastic Dips Due to Temperature Cycle and Thermal Shock
Author :
Shirley, C.G. ; Blish, R.C.
Author_Institution :
Intel Corporation
Abstract :
A test chip was used to compare thin film cracking of various circuit layouts at various positions on the chip, and to study wire ball shear. Slotted aluminum busses reduced thin film cracking in die corners. Thin film cracking and wire ball shear failure rates have remarkably different dependence on shock versus cycle and on lead frame material.
Keywords :
Aluminum; Circuit testing; Electric shock; Packaging; Passivation; Plastic films; Resistors; Temperature; Thin film circuits; Wire;
Conference_Titel :
Reliability Physics Symposium, 1987. 25th Annual
Conference_Location :
San Diego, CA, USA
DOI :
10.1109/IRPS.1987.362185
