Title :
Thermal Fatigue Reliability of SMT Packages and Interconnections
Author :
Lau, J. ; Harkins, G. ; Rice, D. ; Kral, J.
Author_Institution :
Manufacturing Research Center, Hewlett-Packard Laboratories, 3500 Deer Creek Road, Palo Alto, CA 94304
Abstract :
The analytic description of thermal stresses and strains in surface mount chip carrier assemblies have been studied by a nonlinear finite element method. Emphasis is placed on the effects of packaging material and package size on interconnection and package reliability. In parallel, test boards with 68-Pin plastic leaded chip carriers (PLCC) have also been made and subjected to temperature cycling. The observed failure mechanism of the solder joints agreed with the finite element results.
Keywords :
Assembly; Capacitive sensors; Fatigue; Finite element methods; Materials reliability; Packaging; Plastics; Surface-mount technology; Testing; Thermal stresses;
Conference_Titel :
Reliability Physics Symposium, 1987. 25th Annual
Conference_Location :
San Diego, CA, USA
DOI :
10.1109/IRPS.1987.362186
