DocumentCode
2615746
Title
Thermal Fatigue Reliability of SMT Packages and Interconnections
Author
Lau, J. ; Harkins, G. ; Rice, D. ; Kral, J.
Author_Institution
Manufacturing Research Center, Hewlett-Packard Laboratories, 3500 Deer Creek Road, Palo Alto, CA 94304
fYear
1987
fDate
31868
Firstpage
250
Lastpage
259
Abstract
The analytic description of thermal stresses and strains in surface mount chip carrier assemblies have been studied by a nonlinear finite element method. Emphasis is placed on the effects of packaging material and package size on interconnection and package reliability. In parallel, test boards with 68-Pin plastic leaded chip carriers (PLCC) have also been made and subjected to temperature cycling. The observed failure mechanism of the solder joints agreed with the finite element results.
Keywords
Assembly; Capacitive sensors; Fatigue; Finite element methods; Materials reliability; Packaging; Plastics; Surface-mount technology; Testing; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Reliability Physics Symposium, 1987. 25th Annual
Conference_Location
San Diego, CA, USA
ISSN
0735-0791
Type
conf
DOI
10.1109/IRPS.1987.362186
Filename
4208720
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