Title :
A new placement algorithm for custom chip design
Author :
Lin, Z.M. ; Lin, Hung C.
Author_Institution :
Dept. of Electr. Eng., Maryland Univ., College Park, MD, USA
Abstract :
A placement algorithm which consists of three subalgorithms-an O(kn2) circle model relative placement algorithm, an O(n2 log n) triangulation algorithm, and an O(n2 log n2) optimal slicing algorithm for custom chip design-is presented. This relative placement algorithm addresses size effect and net connectivity effect simultaneously, while attaining a low polynomial time complexity O(kn2) without loss of global perspective, where k is a constant and depends on the accuracy that the placement required. The triangulation algorithm has O(n2 log n) time complexity. The triangulated planar graph can be used to do the floorplan be either the nonslicing RDG (rectangular dual graph) or slicing embedding methods. The optimum slicing algorithm has O(n2 log n2) time complexity. As expected, the wire length of the placement algorithm is shorter than that of a point model. However, since the optimal values of l0 and DEF (deformation ratio) are unknown, different values for l0 and DEF should be used in different circuits to obtain better placement results
Keywords :
application specific integrated circuits; circuit layout CAD; graph theory; BSD 4.3 SUN workstation; C language; circle model relative placement algorithm; custom chip design; deformation ratio; global perspective; net connectivity effect; nonslicing RDG; optimal slicing algorithm; point model; polynomial time complexity; rectangular dual graph; size effect; slicing embedding methods; triangulated planar graph; triangulation algorithm; wire length; Chip scale packaging; Circuits; Educational institutions; Joining processes; Shape; Symmetric matrices; Transmission line matrix methods; Wire;
Conference_Titel :
Circuits and Systems, 1990., IEEE International Symposium on
Conference_Location :
New Orleans, LA
DOI :
10.1109/ISCAS.1990.111925