Thermal and electrical properties of brittleness improved epoxy for high voltage

Elastic factor of elastic epoxy was investigated by TMA (thermomechanical analysis) and DMTA (dynamic mechanical thermal analysis) as toughness investigation to improve brittleness of existing epoxy resin. A range of measurement temperature of the TMA and DMTA was changed from -20°C to 200°C. When modifier was the rate of 0 phr, 20 phr, and 35 phr, Tg (glass transition temperature) of elastic epoxy was measured by thermal analysis devices. Also it was investigated thermal expansion coefficient (α), modulus, and Tanδ (loss factor). As thermal analysis results, 20 phr was more excellent than different specimens thermally and mechanically. Also we measured permittivity and Tanδ for investigation with electrical properties of elastic epoxy. The specimens were used 0 phr, 35 phr, and 70 phr. Permittivity and Tanδ have dependency on modifier content. As electrical analysis results, the most excellent specimen was 35 phr.