DocumentCode :
2616844
Title :
Germanium pMOSFET with HfON gate dielectric
Author :
Zhang, Qingchun ; Wu, Nan ; Zhu, Chunxiang ; Li, M.F. ; Chan, DSH ; Chin, Albert ; Kwong, D.L. ; Bera, L.K. ; Balasubramanian, N. ; Du, A.Y. ; Tung, C.H. ; Liu, Haitao ; Sin, Johnny K O
Author_Institution :
Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore
fYear :
2003
fDate :
10-12 Dec. 2003
Firstpage :
256
Lastpage :
257
Abstract :
In this paper, we study about the electrical performance of Ge MOSFET with a thin HfOxNy gate dielectrics. The capacitance-voltage and gate leakage current-voltage characteristics of HfON Ge MOS capacitor was discussed. Sheet resistances are reduced with increasing the annealing temperatures from 360°C to 650°C. Effective carrier mobility of Ge MOSFET was extracted by measuring the gate oxide capacitance and inversion charge. The transconductance and the transfer curves of Ge MOSFET was analysed at room temperature.
Keywords :
MOS capacitors; MOSFET; annealing; dielectric materials; elemental semiconductors; germanium; hafnium compounds; hole mobility; 293 to 298 K; 360 to 650 degC; Ge-HfON; HfON Ge MOS capacitor; HfON gate dielectrics; annealing; capacitance-voltage curves; carrier mobility; electrical performance; gate leakage current-voltage curves; gate oxide capacitance; germanium pMOSFET; inversion charge; room temperature; sheet resistance reduction; transconductance; transfer curves; Capacitance-voltage characteristics; Current-voltage characteristics; Dielectrics; Gate leakage; Germanium; Hafnium oxide; Leakage current; MOS capacitors; MOSFET circuits; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Device Research Symposium, 2003 International
Print_ISBN :
0-7803-8139-4
Type :
conf
DOI :
10.1109/ISDRS.2003.1272086
Filename :
1272086
Link To Document :
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