Title :
Modeling of power/ground plane noise in high speed digital electronics packaging
Author :
Fang, Jiayuan ; Liu, Yaowu ; Chen, Yuzhe ; Wu, Zhonghua ; Agrawal, Amit
Author_Institution :
Dept. of Electr. Eng., State Univ. of New York, Binghamton, NY, USA
Abstract :
A new model for the simulation of power/ground plane noise which is simple in principle, accurate in its solutions, and applicable to various levels of high-speed digital electronics packaging, is given. It is found that one can obtain accurate modeling of delta-I noise in power and ground planes without resorting to full-wave electromagnetic modeling. Sample results of the simulated delta-I noise with the method are shown
Keywords :
circuit analysis computing; digital integrated circuits; integrated circuit modelling; integrated circuit noise; integrated circuit packaging; CAD modelling tools; delta-I noise; full-wave electromagnetic modeling; high speed digital electronics packaging; integrated circuits; noise modelling; power/ground plane noise simulation; Artificial intelligence; Electromagnetic modeling; Electronics packaging; Impedance; Integrated circuit noise; Noise figure; Noise level; Power system modeling; Power transmission lines; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1993
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-1427-1
DOI :
10.1109/EPEP.1993.394553
