Full wave characterization of a through hole via

Author

Hsu, Show-Gwo ; Wu, Ruey-Beei

Author_Institution

Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan

fYear

1993

fDate

20-22 Oct 1993

Firstpage

185

Lastpage

188

Abstract

The frequency-dependent propagation characteristics of a via penetrating through a hole in the ground plane are investigated by a numerical approach which combines the moment method and the matrix pencil method to extract the scattering parameters. Numerical results are included to discuss the frequency dependence of the propagation characteristics and the effects due to various geometric parameters of the via structure

Keywords

S-parameters; electromagnetic wave propagation; integrated circuit interconnections; integrated circuit packaging; large scale integration; matrix algebra; method of moments; numerical analysis; TEM modes; frequency dependence; full wave characterisation; geometric parameters; large scale integration; matrix pencil method; moment method; multilayer interconnections; numerical approach; propagation characteristics; scattering parameters; through hole via; via structure; Distributed parameter circuits; Electromagnetic radiation; Electromagnetic scattering; Frequency dependence; Integrated circuit interconnections; Large scale integration; Moment methods; Transmission line matrix methods; Transmission line theory; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1993

Conference_Location

Monterey, CA

Print_ISBN

0-7803-1427-1

Type

conf

DOI

10.1109/EPEP.1993.394558

Filename

394558