Title :
Full wave characterization of a through hole via
Author :
Hsu, Show-Gwo ; Wu, Ruey-Beei
Author_Institution :
Dept. of Electr. Eng., Nat. Taiwan Univ., Taipei, Taiwan
Abstract :
The frequency-dependent propagation characteristics of a via penetrating through a hole in the ground plane are investigated by a numerical approach which combines the moment method and the matrix pencil method to extract the scattering parameters. Numerical results are included to discuss the frequency dependence of the propagation characteristics and the effects due to various geometric parameters of the via structure
Keywords :
S-parameters; electromagnetic wave propagation; integrated circuit interconnections; integrated circuit packaging; large scale integration; matrix algebra; method of moments; numerical analysis; TEM modes; frequency dependence; full wave characterisation; geometric parameters; large scale integration; matrix pencil method; moment method; multilayer interconnections; numerical approach; propagation characteristics; scattering parameters; through hole via; via structure; Distributed parameter circuits; Electromagnetic radiation; Electromagnetic scattering; Frequency dependence; Integrated circuit interconnections; Large scale integration; Moment methods; Transmission line matrix methods; Transmission line theory; Wire;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1993
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-1427-1
DOI :
10.1109/EPEP.1993.394558
