Title :
Structure of Ball Grid Array/Permanent semi-elastomeric thermally conductive crumb rubber reinforced bituminous Stencil/Printed Circuit Board interconnects
Author :
Karydopoulos, P. ; Frantzis, P. ; Karagiannis, N.
Author_Institution :
Comput. Syst., Thessaloniki, Greece
Abstract :
An investigation is reported into the structure of Ball Grid Array/Permanent Stencil/Printed Circuit Board interconnects produced when semi-elastomeric bituminous stencils are formed or placed within standard interconnects. Such interconnects have the potential to extend the service life of Printed Circuit Boards especially for use in aviation, shipping and military applications.
Keywords :
ball grid arrays; printed circuit interconnections; ball grid array; permanent stencil; printed circuit board interconnects; semielastomeric bituminous stencils; Conductivity; Copper; Electronics packaging; Materials; Portable computers; Rubber; Thermal conductivity; BGA; Bituminous permanent stencils; Crumb rubber; Interconnects; PCB;
Conference_Titel :
Telecommunications Forum Telfor (TELFOR), 2014 22nd
Conference_Location :
Belgrade
Print_ISBN :
978-1-4799-6190-0
DOI :
10.1109/TELFOR.2014.7034493
