DocumentCode
2617059
Title
Directions in silicon-on-silicon MCMs
Author
Frye, Robert C.
Author_Institution
AT&T Bell Lab., Murray Hill, NJ
fYear
1993
fDate
20-22 Oct 1993
Firstpage
161
Abstract
The author reports on research on silicon-based multi-chip module (MCM) technology at AT&T Bell Laboratories, including cost-driven mixed signal applications and the benefits of re-designing chips specifically for the low loading environment of MCMs
Keywords
elemental semiconductors; integrated circuit design; mixed analogue-digital integrated circuits; multichip modules; silicon; Si-Si; chip design; cost-driven mixed signal; low loading environment; multichip module; semiconductor; Bandwidth; CMOS technology; Costs; Electronics packaging; Explosives; Integrated circuit interconnections; Power system interconnection; Silicon; Very large scale integration; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1993
Conference_Location
Monterey, CA
Print_ISBN
0-7803-1427-1
Type
conf
DOI
10.1109/EPEP.1993.394565
Filename
394565
Link To Document