Title :
Package measurement methodology using a surface mount jig
Author :
Luk, Timwah ; Hosseini, Mahdi
Abstract :
Scattering-parameter, time domain reflectometry, and low frequency LCR measurement techniques, and the design of a universal jig for these measurements are described. This jig minimizes parasitics associated with the measurements, and provides a uniform ground plane. The advantages of using this universal jig for the above measurements are discussed, and measurement examples for specific measurement types are provided
Keywords :
Contacts; Electrical resistance measurement; Frequency measurement; Integrated circuit measurements; Integrated circuit packaging; Measurement techniques; Pins; Reflectometry; Semiconductor device packaging; Time measurement;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1993
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-1427-1
DOI :
10.1109/EPEP.1993.394566
