Title :
Characterization of multiple line interconnection structures from time domain measurements
Author :
Hayden, L.A. ; Jong, J.M. ; Tripathi, V.K.
Author_Institution :
Dept. of Electr. & Comput. Eng., Oregon State Univ., Corvallis, OR, USA
Abstract :
An experimental method for the time domain characterization of a class of nonuniformly coupled interconnection lines is presented. Electrical circuit models for constant velocity structures are extracted from time domain reflection (TDR) measurements
Keywords :
microstrip discontinuities; packaging; time-domain reflectometry; SPICE simulation; TDR measurement; constant velocity structures; electrical circuit models; microstrip lines; multiple line interconnection structures; nonuniformly coupled interconnection lines; scattering discontinuity; time domain characterization; time domain reflection; Acoustic scattering; Admittance; Delay; Dielectric measurements; Impedance; Integrated circuit interconnections; Inverse problems; Microstrip; Time measurement; Transmission line matrix methods;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1993
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-1427-1
DOI :
10.1109/EPEP.1993.394568
