DocumentCode
2617111
Title
Experimental characterization of interconnects and discontinuities in thin-film multichip module substrates
Author
Steer, Michael B. ; Lipa, Steven ; Franzon, Paul D.
Author_Institution
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
fYear
1993
fDate
20-22 Oct 1993
Firstpage
145
Lastpage
147
Abstract
Interconnects and discontinuities in a thin-film multichip module substrate are experimentally characterized, taking into account the effective dielectric loss attributed to dielectric anisotropy of the thin-film
Keywords
dielectric losses; integrated circuit interconnections; microstrip discontinuities; multichip modules; CAD via model; dielectric anisotropy; discontinuities characterisation; effective dielectric loss; interconnects characterisation; microstrip lines; thin-film multichip module substrates; Anisotropic magnetoresistance; Dielectric losses; Dielectric substrates; Dielectric thin films; Frequency; Impedance; Integrated circuit interconnections; Multichip modules; Thin film circuits; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 1993
Conference_Location
Monterey, CA
Print_ISBN
0-7803-1427-1
Type
conf
DOI
10.1109/EPEP.1993.394569
Filename
394569
Link To Document