Title :
Experimental characterization of interconnects and discontinuities in thin-film multichip module substrates
Author :
Steer, Michael B. ; Lipa, Steven ; Franzon, Paul D.
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Abstract :
Interconnects and discontinuities in a thin-film multichip module substrate are experimentally characterized, taking into account the effective dielectric loss attributed to dielectric anisotropy of the thin-film
Keywords :
dielectric losses; integrated circuit interconnections; microstrip discontinuities; multichip modules; CAD via model; dielectric anisotropy; discontinuities characterisation; effective dielectric loss; interconnects characterisation; microstrip lines; thin-film multichip module substrates; Anisotropic magnetoresistance; Dielectric losses; Dielectric substrates; Dielectric thin films; Frequency; Impedance; Integrated circuit interconnections; Multichip modules; Thin film circuits; Transistors;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1993
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-1427-1
DOI :
10.1109/EPEP.1993.394569
