Noise mitigation in high-speed systems using electromagnetic high-impedance surface

In this work, we discuss the novel concept of using high impedance surfaces (HIS), or electromagnetic band gap structures to address critical electromagnetic noise problems in high-speed circuit, packages, boards, and cavities. We show that the HIS offer significant advantages in a class applications that far exceeds the narrow range of antenna applications. We introduce the concept of cascading HIS of different topologies to provide ultra-wide band suppression for switching noise that is considered a fundamental bottleneck in high-speed printed circuit board design. The S₂₁ parameter for a printed circuit board with three different HIS topologies are shown. The use of HIS in mitigation of EMI from circuit boards and in reducing cavity radiation is also demonstrated.