DocumentCode :
2617168
Title :
Exploiting symmetry in the extraction of electrical packaging parameters
Author :
Huang, Ching-Chao
Author_Institution :
IBM Raleigh, Research Triangle Park, NC, USA
fYear :
1993
fDate :
20-22 Oct 1993
Firstpage :
125
Lastpage :
127
Abstract :
The author examines three different aspects of exploiting a structure´s symmetry to efficiently compute electrical packaging parameters: (a) recognizing the cross-sectional symmetry eases the numerical integration of 3-D partial inductances; (b) the direct inversion of a partial impedance matrix lets one take advantage of a structure´s symmetry in computing resistance and inductance matrices of uniformly coupled transmission lines; and (c) an almost symmetric and/or periodic structure can be either decomposed or augmented to exploit the special property of its corresponding system matrix
Keywords :
electric impedance; inductance; integration; matrix inversion; network parameters; packaging; skin effect; symmetry; 3D partial inductance; CPV time; cross-sectional symmetry; direct inversion; electrical packaging parameters; inductance matrices; numerical integration; partial impedance matrix; periodic structure; resistance matrix; skin effect; system matrix; uniformly coupled transmission lines; Conductors; Electric resistance; Geometry; Impedance; Inductance; Matrix decomposition; Packaging; Periodic structures; Symmetric matrices; Transmission line matrix methods;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 1993
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-1427-1
Type :
conf
DOI :
10.1109/EPEP.1993.394574
Filename :
394574
Link To Document :
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