Evaluation of ground inductance in printed circuit boards

Author

Yook, Jong-Gwan ; Kurk, Morgan ; Dib, Nihad I. ; Katehi, Linda P B ; Arabi, Tawfic R.

Author_Institution

Dept. of Electr. Eng. & Comput. Sci. Michigan Univ., Ann Arbor, MI, USA

fYear

1993

fDate

20-22 Oct 1993

Firstpage

119

Lastpage

112

Abstract

The problem of a printed circuit board (PCB) via is analyzed through the scattering parameter and the flux methods. The two results are compared in an effort to establish the relationship between the two techniques and evaluate their contributions. A ground via in a one-port and two-port configuration is studied in the time and frequency domains using the finite difference time domain (FDTD) and the finite element method (FEM) respectively. The scattering parameters for the via configuration are computed and compared for validation purposes

Keywords

S-parameters; finite difference time-domain analysis; finite element analysis; inductance; printed circuit layout; two-port networks; 10 to 30 GHz; FDTD; FEM; PCB via; finite difference time domain method; finite element method; flux methods; frequency domains; ground inductance; ground via; numerical technique; one-post configuration; packaging; printed circuit board; scattering parameter; two-port configuration; Finite difference methods; Finite element methods; Fluctuations; Frequency domain analysis; Inductance; Integrated circuit noise; Magnetic flux; Magnetic noise; Printed circuits; Scattering parameters;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 1993

Conference_Location

Monterey, CA

Print_ISBN

0-7803-1427-1

Type

conf

DOI

10.1109/EPEP.1993.394575

Filename

394575