Title :
A new three dimensional finite difference time domain (3D-FDTD) simulator for modelling electronic interconnections and packaging
Author :
Lu, Lynda X. ; Wu, Chen ; Litva, John
Author_Institution :
Commun. Res. Lab., McMaster Univ., Hamilton, Ont., Canada
Abstract :
It has been shown that the finite difference time domain (FDTD) method is an accurate and flexible technique to simulate complex electromagnetic problems. A 3D-FDTD software package is introduced. It can be used to simulate electronic packaging problems from an electromagnetic field point of view
Keywords :
circuit CAD; circuit analysis computing; finite difference time-domain analysis; integrated circuit interconnections; integrated circuit packaging; 3D-FDTD software package; electromagnetic problems; electronic interconnections modelling; electronic packaging simulation; three dimensional finite difference time domain simulator; Electronics packaging; Finite difference methods; Frequency domain analysis; Graphics; Integrated circuit interconnections; Maxwell equations; Mesh generation; Predictive models; Software packages; Time domain analysis;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1993
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-1427-1
DOI :
10.1109/EPEP.1993.394582
