Title :
A new, efficient circuit model for microstrip lines including both current crowding and skin depth effects
Author :
Tuncer, E. ; Kim, S.Y. ; Pillage, L.T. ; Neikirk, D.P.
Author_Institution :
Dept. of Electr. & Comput. Eng., Texas Univ., Austin, TX, USA
Abstract :
A new method for the efficient extraction of multichip (MCM) interconnect, including both current crowding and skin effect, is described. Conformal mapping is used to extract frequency-independent circuit models of the interconnect. A very efficient time domain simulation of interconnects with nonlinear drivers and loads is then performed
Keywords :
circuit analysis computing; integrated circuit interconnections; microstrip lines; multichip modules; skin effect; time-domain analysis; MCM interconnect; circuit model; conformal mapping; current crowding; microstrip lines; multichip interconnect; nonlinear drivers; nonlinear loads; skin depth effects; time domain simulation; Circuit simulation; Conductors; Conformal mapping; Frequency; Inductance; Integrated circuit interconnections; Microstrip; Proximity effect; Skin; Surface impedance;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1993
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-1427-1
DOI :
10.1109/EPEP.1993.394584
