Title :
Noise containment in a high wiring density multichip module
Author :
Venkatachalam, P.N. ; Smith, Howard ; Rippens, Roger
Author_Institution :
IBM, Poughkeepsie, NY, USA
Abstract :
A methodology for containing coupled noise in a high wiring density multichip module (MCM) in which hundreds of nets interact with each other is outlined. TEM mode multi-conductor transmission line analysis and a time-based statistical technique are the basis for a sophisticated design analysis and which predicts the aggregate noise for each net. Nets exceeding a predetermined voltage limit, set by the receiver noise margin, are reworked iteratively until technology constraints are satisfied
Keywords :
circuit layout CAD; integrated circuit noise; multichip modules; statistical analysis; MCM; TEM mode multi-conductor transmission line analysis; aggregate noise; coupled noise containment; design analysis; high wiring density multichip module; iteractive rework placement and routing tools; receiver noise margin; time-based statistical technique; voltage limit; Active noise reduction; Algorithm design and analysis; Circuit noise; Circuit testing; Coupling circuits; Crosstalk; Multichip modules; Packaging; Wires; Wiring;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1993
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-1427-1
DOI :
10.1109/EPEP.1993.394590
