Title :
Performance comparison of single- and multiple-chip packages in a personal computer application
Author_Institution :
IBM Corp., Boca Raton, FL, USA
Abstract :
The multi-chip module (MCM) package shows considerable improvement in performance and signal quality as compared to single-chip modules on cards. It can support 40-45% faster clock rates due to reduced clock skews and distortions. It also yields 40-45% better net delays due to reduced capacitance loading, reduced effective time-of-flight delays, and shorter chip interconnect distances. The MCM package shows signal quality improvements for specific net cross sections due to reduced effective loadings, and a better controlled system. It also yields better electrical characteristic tolerances
Keywords :
integrated circuit packaging; microcomputers; multichip modules; Intel 486 microprocessor; MCM package; capacitance loading; chip interconnect distances; clock rates; clock skews; distortions; effective time-of-flight delays; electrical characteristic tolerances; multichip module package; personal computer; signal quality; single-chip modules; Application software; Bonding; Clocks; Crosstalk; Delay effects; Frequency; Logic; Microcomputers; Packaging; Parasitic capacitance;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1993
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-1427-1
DOI :
10.1109/EPEP.1993.394603