Title :
Package requirements for high performance VLSI CMOS chips
Author_Institution :
IBM Corp., Poughkeepsie, NY, USA
Abstract :
There is a set of unique characteristics that can make the choice of package attributes even more critical for CMOS than when designing with a bipolar or GaAs technology. The CMOS packaging concerns are caused by features that make it a desirable technology choice for high performance systems. They are: switching speed, high density, and no DC power. These items can drive the need for a package definition that requires all of the complexity and cost of the kinds of packaging normally thought of for mainframes and supercomputers
Keywords :
CMOS integrated circuits; VLSI; integrated circuit packaging; CMOS packaging; GaAs technology; VLSI CMOS chips; bipolar technology; high performance systems; mainframes; packaging requirements; supercomputers; switching speed; CMOS technology; Circuits; Clocks; Costs; Crosstalk; Delay; Gallium arsenide; Packaging machines; Supercomputers; Very large scale integration;
Conference_Titel :
Electrical Performance of Electronic Packaging, 1993
Conference_Location :
Monterey, CA
Print_ISBN :
0-7803-1427-1
DOI :
10.1109/EPEP.1993.394605
