DocumentCode :
2617623
Title :
Proceedings of IEEE Electrical Performance of Electronic Packaging
fYear :
1993
fDate :
20-22 Oct. 1993
Abstract :
The following topics are dealt with: system design; microwave packaging; electromagnetic modeling and parameter extraction; automated package design; measurements; modeling; packaging for communications; simulation; and characterization
Keywords :
circuit CAD; circuit analysis computing; microwave circuits; packaging; automated package design; electromagnetic modeling; measurements; microwave packaging; packaging for communications; parameter extraction; simulation; system design;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electrical Performance of Electronic Packaging, 1993
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-1427-1
Type :
conf
DOI :
10.1109/EPEP.1993.394606
Filename :
394606
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2617623
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