DocumentCode :
2617663
Title :
Reliability concerns in contemporary SiC power devices
Author :
Singh, Ranbir ; Hefner, Allen R. ; McNutt, Ty R.
Author_Institution :
Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
fYear :
2003
fDate :
10-12 Dec. 2003
Firstpage :
368
Lastpage :
369
Abstract :
This paper attempts to show some of the reliability issues faced by contemporary SiC power devices. Material defects in SiC are the cause of many reliability issues in the SiC devices, such as (a) reduced critical electric field in devices, (b) higher leakage currents during reverse bias operation and (c) degradation in the on-state performance of bipolar devices. Detailed experiments conducted on SiC devices have shown that the on-state voltage drop on these devices increases with time when they are kept in the forward biased mode for appreciable length of time.
Keywords :
crystal defects; leakage currents; power MOSFET; semiconductor device reliability; silicon compounds; wide band gap semiconductors; SiC; bipolar devices; contemporary SiC power devices; critical electric field; forward biased mode; leakage currents; material defects; reliability; reverse bias operation; Conducting materials; Degradation; Dielectric materials; Optical propagation; Schottky diodes; Silicon carbide; Stacking; Thermal conductivity; Tunneling; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Device Research Symposium, 2003 International
Print_ISBN :
0-7803-8139-4
Type :
conf
DOI :
10.1109/ISDRS.2003.1272139
Filename :
1272139
Link To Document :
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