• DocumentCode
    2617663
  • Title

    Reliability concerns in contemporary SiC power devices

  • Author

    Singh, Ranbir ; Hefner, Allen R. ; McNutt, Ty R.

  • Author_Institution
    Nat. Inst. of Stand. & Technol., Gaithersburg, MD, USA
  • fYear
    2003
  • fDate
    10-12 Dec. 2003
  • Firstpage
    368
  • Lastpage
    369
  • Abstract
    This paper attempts to show some of the reliability issues faced by contemporary SiC power devices. Material defects in SiC are the cause of many reliability issues in the SiC devices, such as (a) reduced critical electric field in devices, (b) higher leakage currents during reverse bias operation and (c) degradation in the on-state performance of bipolar devices. Detailed experiments conducted on SiC devices have shown that the on-state voltage drop on these devices increases with time when they are kept in the forward biased mode for appreciable length of time.
  • Keywords
    crystal defects; leakage currents; power MOSFET; semiconductor device reliability; silicon compounds; wide band gap semiconductors; SiC; bipolar devices; contemporary SiC power devices; critical electric field; forward biased mode; leakage currents; material defects; reliability; reverse bias operation; Conducting materials; Degradation; Dielectric materials; Optical propagation; Schottky diodes; Silicon carbide; Stacking; Thermal conductivity; Tunneling; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Device Research Symposium, 2003 International
  • Print_ISBN
    0-7803-8139-4
  • Type

    conf

  • DOI
    10.1109/ISDRS.2003.1272139
  • Filename
    1272139