DocumentCode
2617708
Title
Calculation of lattice heating in 4H-SiC RF power devices, based on 2D electrical and 3D thermal simulations
Author
Bertilsson, K. ; Harris, C. ; Nilsson, H.-E.
Author_Institution
Dept. of Inf. Technol. & Media, Mid Sweden Univ., Sweden
fYear
2003
fDate
10-12 Dec. 2003
Firstpage
370
Lastpage
371
Abstract
The paper presents the thermal effects of 4H-SiC RF power devices using simulation based on a combination of 2D device simulations for the electrical transport and 3D thermal simulation for the lattice heating. Using the combined device simulation model the feasibility for different kinds of layouts and the influence on the device performance for SiC RF power MESFET is presented.
Keywords
power MESFET; semiconductor device models; silicon compounds; wide band gap semiconductors; 2D electrical simulations; 3D thermal simulations; 4H-SiC RF power devices; SiC; SiC RF power MESFET; electrical transport; lattice heating; thermal effects; Cogeneration; Electric resistance; Fingers; Lattices; Radio frequency; Resistance heating; Silicon carbide; Temperature; Thermal conductivity; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Device Research Symposium, 2003 International
Print_ISBN
0-7803-8139-4
Type
conf
DOI
10.1109/ISDRS.2003.1272140
Filename
1272140
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