DocumentCode
2618158
Title
Hierarchical distributed simulation for 300mm wafer fab
Author
Xu, Sheng ; McGinnis, Leon F.
Author_Institution
Georgia Inst. of Technol., Atlanta
fYear
2007
fDate
9-12 Dec. 2007
Firstpage
1774
Lastpage
1780
Abstract
Distributed simulation promises benefits in large-scale simulations, such as in high fidelity simulation of 300 mm wafer fabs, although these benefits have been hard to achieve in practice. This paper examines the fundamentals of distributed simulation, and proposes a hierarchical approach to distributed wafer fab simulation, which has the potential to achieve significant reduction in model execution time.
Keywords
digital simulation; distributed processing; production engineering computing; semiconductor device manufacture; wafer-scale integration; hierarchical distributed simulation; high fidelity simulation; large-scale simulations; wafer fab; Analytical models; Computational modeling; Discrete event simulation; Distributed computing; Industrial engineering; Large-scale systems; Manufacturing systems; Semiconductor device modeling; Synchronization; Systems engineering and theory;
fLanguage
English
Publisher
ieee
Conference_Titel
Simulation Conference, 2007 Winter
Conference_Location
Washington, DC
Print_ISBN
978-1-4244-1305-8
Electronic_ISBN
978-1-4244-1306-5
Type
conf
DOI
10.1109/WSC.2007.4419802
Filename
4419802
Link To Document