• DocumentCode
    2618158
  • Title

    Hierarchical distributed simulation for 300mm wafer fab

  • Author

    Xu, Sheng ; McGinnis, Leon F.

  • Author_Institution
    Georgia Inst. of Technol., Atlanta
  • fYear
    2007
  • fDate
    9-12 Dec. 2007
  • Firstpage
    1774
  • Lastpage
    1780
  • Abstract
    Distributed simulation promises benefits in large-scale simulations, such as in high fidelity simulation of 300 mm wafer fabs, although these benefits have been hard to achieve in practice. This paper examines the fundamentals of distributed simulation, and proposes a hierarchical approach to distributed wafer fab simulation, which has the potential to achieve significant reduction in model execution time.
  • Keywords
    digital simulation; distributed processing; production engineering computing; semiconductor device manufacture; wafer-scale integration; hierarchical distributed simulation; high fidelity simulation; large-scale simulations; wafer fab; Analytical models; Computational modeling; Discrete event simulation; Distributed computing; Industrial engineering; Large-scale systems; Manufacturing systems; Semiconductor device modeling; Synchronization; Systems engineering and theory;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Simulation Conference, 2007 Winter
  • Conference_Location
    Washington, DC
  • Print_ISBN
    978-1-4244-1305-8
  • Electronic_ISBN
    978-1-4244-1306-5
  • Type

    conf

  • DOI
    10.1109/WSC.2007.4419802
  • Filename
    4419802