Plastic molded analog isolation amplifier

A plastic-packaged analog isolation amplifier that utilizes a capacitive coupled path for encoded signals and is capable of operating at high voltage levels is described. The assembly uses standard techniques for building plastic packages, allowing high-volume assembly at low cost without sacrificing performance. There is a small interconnect circuit which is used to capacitively couple the signal from the input to the output. A pick-and-place machine is used to attach the interconnect substrate to the leadframe. A two-pass die attach is used to place die on the leadframe. A two-cavity wirebond clamp is used to hold down the leadframe during wirebonding