DocumentCode :
2618578
Title :
Specular X-ray reflectivity and small angle X-ray scattering study of ultra-low dielectric constant methylsilesquioxane films
Author :
Goh, T.K. ; Wu, S. ; Wong, T.K.S.
Author_Institution :
Inst. of Microelectron., Singapore, Singapore
fYear :
2003
fDate :
10-12 Dec. 2003
Firstpage :
458
Lastpage :
459
Abstract :
In this paper, specular X-ray reflectivity (SXR), small angle X-ray scattering (SAXS) and ion beam analysis (IBA) have been used for the quantitative structural characterization of a proprietary MSQ based porous dielectric material, JSR LKD-5109 with dielectric constant k=2.2. Parametric structural models of the LKD films have been developed for the analysis of both SXR and SAXS data. SXR measurements were performed using a Siemens D5005 X-ray diffractometer equipped with a reflectivity sample stage. Transmission SAXS measurements were conducted using a Bruker AXS Nanostar small angle scattering instrument.
Keywords :
X-ray diffraction; X-ray scattering; dielectric materials; dielectric thin films; organic compounds; permittivity; porous materials; reflectivity; MSQ based porous dielectric material; SAXS; X-ray diffraction; X-ray scattering; dielectric thin films; ion beam analysis; parametric structural models; quantitative structural characterization; specular X-ray reflectivity; ultra low dielectric constant methylsilesquioxane films; Dielectric constant; Dielectric materials; Dielectric measurements; Instruments; Ion beams; Optical films; Performance evaluation; Reflectivity; X-ray diffraction; X-ray scattering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Device Research Symposium, 2003 International
Print_ISBN :
0-7803-8139-4
Type :
conf
DOI :
10.1109/ISDRS.2003.1272187
Filename :
1272187
Link To Document :
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