DocumentCode :
2618801
Title :
Design and operation of reactive gas delivery systems for IC fabrication plants
Author :
Chou, Yung-ho ; Su, Tienpao ; Chen, Michael S K ; Fine, S.M. ; George, M.A. ; McGuire, J.T. ; Dheandhanoo, S. ; Yang, James H. ; Ciotti, R.J. ; Yesenofski, David F.
Author_Institution :
Sanfu Chem. Co. Ltd., Shan-Hua, Taiwan
fYear :
2000
fDate :
2000
Firstpage :
243
Lastpage :
250
Abstract :
This article describes equipment design criteria and equipment operation for ultra-high purity (UHP) reactive gases. Selection of material and proper operation are critical for consistent and reliable gas delivery. Corrosion and subsequent contaminants are detrimental to downstream processes. The HBr case is used to illustrate the influence of moisture content on HBr corrosivity toward common materials of construction. Proper drydown and system operation at lower pressure to avoid vapor condensation alleviate the corrosion problem and maintain reliable gas delivery. We propose a drydown model to predict the drydown time, and perform experiments to confirm the predicted drydown time. The moisture is modeled as a chemisorbed monolayer on equipment and several physisorbed layers of water molecules on top of the chemisorbed layer. Addition of moisture not only aggravates corrosion, but also reduces the saturation pressure and causes vapor condensation. A previous study shows that higher operating pressure results in more severe corrosion. A better practice is to operate the system much below the saturation pressure at room temperature. This allows a reasonable safety margin. The gas system manifold is discussed, and basic heat transfer and fluid dynamics models are used to examine the system. It is shown that with proper design and operation, steady delivery can be maintained over a long distance
Keywords :
chemical technology; corrosion; drying; etching; fluid dynamics; heat transfer; integrated circuit manufacture; integrated circuit reliability; materials handling; moisture; semiconductor process modelling; HBr; HBr corrosivity; IC fabrication plants; UHP reactive gases; chemisorbed monolayer; contaminants; corrosion; downstream processes; drydown; drydown model; drydown time; equipment design criteria; equipment operation; etch rate; etch step; fluid dynamics model; gas system manifold; heat transfer model; material selection; moisture; moisture content; moisture model; physisorbed layers; reactive gas delivery system design; reactive gas delivery system operation; reactive gas delivery systems; reliable gas delivery; safety margin; saturation pressure; system operating pressure; ultra-high purity reactive gases; vapor condensation; water molecules; Building materials; Corrosion; Gases; Heat transfer; Maintenance; Materials reliability; Moisture; Predictive models; Safety; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Manufacturing Technology Workshop, 2000
Conference_Location :
Hsinchu
Print_ISBN :
0-7803-6374-4
Type :
conf
DOI :
10.1109/SMTW.2000.883102
Filename :
883102
Link To Document :
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