Mixed-mode simulation of non-isothermal quantum device operation and full-chip heating

A methodology that connects full-chip heating to quantum non-isothermal device equations is developed. On the device level, the quantum device transport model which includes the Schrodinger, Poisson, electron current-continuity, hole current-continuity and the lattice heating equation are coupled. The chip heating model is a KCL-type thermal network that can be derived by integrating the differential heat flow equation. The two models are interfaced by a mixed-mode Monte Carlo type method.