Mixed-mode simulation of non-isothermal quantum device operation and full-chip heating

Author

Akturk, Akin ; Parker, Latise ; Goldsman, Neil ; Metze, George

Author_Institution

Dept. of Electr. & Comput. Eng., Maryland Univ., College Park, MD, USA

fYear

2003

fDate

10-12 Dec. 2003

Firstpage

508

Lastpage

509

Abstract

A methodology that connects full-chip heating to quantum non-isothermal device equations is developed. On the device level, the quantum device transport model which includes the Schrodinger, Poisson, electron current-continuity, hole current-continuity and the lattice heating equation are coupled. The chip heating model is a KCL-type thermal network that can be derived by integrating the differential heat flow equation. The two models are interfaced by a mixed-mode Monte Carlo type method.

Keywords

MOSFET; Monte Carlo methods; Poisson equation; Schrodinger equation; microprocessor chips; semiconductor device models; KCL type thermal network; Poisson equation; Schrodinger equation; chip heating model; differential heat flow equation; electron current continuity; full chip heating; hole current continuity; lattice heating equation; mixed mode Monte Carlo type method; mixed mode simulation; quantum device transport model; quantum nonisothermal quantum device; Educational institutions; Flowcharts; Lattices; Nonlinear equations; Packaging; Poisson equations; Resistance heating; Temperature; Thermal resistance; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Device Research Symposium, 2003 International

Print_ISBN

0-7803-8139-4

Type

conf

DOI

10.1109/ISDRS.2003.1272234

Filename

1272234