DocumentCode
2619458
Title
Contributing vertices-based Minkowski sum of a non-convex polyhedron without fold and a convex polyhedron
Author
Barki, Hichem ; Denis, Florence ; Dupont, Florent
Author_Institution
CNRS, Univ. de Lyon, Villeurbanne, France
fYear
2009
fDate
26-28 June 2009
Firstpage
73
Lastpage
80
Abstract
We present an original approach for the computation of the Minkowski sum of a non-convex polyhedron without fold and a convex polyhedron, without decomposition and union steps-that constitute the bottleneck of convex decomposition-based algorithms. A non-convex polyhedron without fold is a polyhedron whose boundary is completely recoverable from three orthographic projections defined by three orthogonal basis vectors in Ropf3. First, we generate a superset of the Minkowski sum facets using the concept of contributing vertices we accommodate for a non-convex-convex pair of polyhedra. The generated superset guarantees that its envelope is the boundary of the Minkowski sum polyhedron. Secondly, we extract the Minkowski sum facets and handle the intersections among the superset facets by using 3D envelope computation. Our approach is limited to non-convex polyhedra without fold because of the use of 3D envelope computation to recover the Minkowski sum boundary. Models with holes are not handled by our method. The implementation of our algorithm uses exact number types, produces exact results, and is based on CGAL, the Computational Geometry Algorithms Library.
Keywords
computational geometry; solid modelling; 3D envelope computation; Minkowski sum facets; convex decomposition; nonconvex polyhedron; orthogonal basis vectors; vertices-based Minkowski sum; Animation; Application software; Computational geometry; Computer aided manufacturing; Computer applications; Image edge detection; Image motion analysis; Libraries; Shape; Virtual manufacturing; 3D envelope computation; Minkowski sum; contributing vertices;
fLanguage
English
Publisher
ieee
Conference_Titel
Shape Modeling and Applications, 2009. SMI 2009. IEEE International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-4069-6
Electronic_ISBN
978-1-4244-4070-2
Type
conf
DOI
10.1109/SMI.2009.5170166
Filename
5170166
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