Title :
EMC/EMI design and analysis using FDTD
Author :
Mix, Jason ; Haussmann, Gary ; Piket-May, Melinda ; Thomas, Kevin
Author_Institution :
Colorado Univ., Boulder, CO, USA
Abstract :
The integrity of a signal on an interconnect is affected by coupling due to other interconnects or the package, as well as discontinuities introduced by imperfect ground and power planes. Therefore, packaging and the specific layout of interconnects have a significant impact on the functional characteristics of a product. In order to prevent system problems, EMC/EMI concerns should be addressed at the design stage and not left as an afterthought. A full wave solution of the electromagnetic fields provide quantitative results for evaluation of signal integrity such as the current or voltage at specific points along the line. In addition, it also provides the electric and magnetic fields throughout. The structure that may lead to qualitative insights into the interactions between system components. Such insight may be an invaluable tool for solving EMC/EMI problems. The finite difference time domain (FDTD) technique is a full wave solver of the electromagnetic fields. This paper discusses the application of FDTD to the TC-9 challenge problems in EMC design including initial results, the problem chosen for simulation, and the reasons for our choice
Keywords :
electric fields; electromagnetic compatibility; electromagnetic fields; electromagnetic interference; finite difference time-domain analysis; interconnections; magnetic fields; packaging; EMC design; EMI design; FDTD; TC-9 challenge problems; coupling; discontinuities; electric fields; electromagnetic fields; finite difference time domain; full wave solution; full wave solver; imperfect ground plane; imperfect power plane; interconnect; interconnects layout; magnetic fields; packaging; signal integrity; Electromagnetic compatibility; Electromagnetic interference; Electromagnetic scattering; Finite difference methods; Packaging; Power system interconnection; Power system reliability; Pulse measurements; Time domain analysis; Voltage;
Conference_Titel :
Electromagnetic Compatibility, 1998. 1998 IEEE International Symposium on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-5015-4
DOI :
10.1109/ISEMC.1998.750081