DocumentCode :
2619999
Title :
The Lincoln programmable image-processing wafer
Author :
Berger, R. ; Bertapelli, A. ; Frankel, R. ; Hunt, J.J. ; Mann, J. ; Raffel, J.I. ; Rhodes, F.M. ; Soares, A. ; Woodward, C.
Author_Institution :
MIT, Lincoln Lab., Lexington, MA, USA
fYear :
1990
fDate :
23-25 Jan 1990
Firstpage :
20
Lastpage :
26
Abstract :
The Programmable Image Processor is a laser-restructurable, wafer-scale device fabricated on a 125-mm wafer using an n-well CMOS process with 2.0 micrometer gates. Yield projections indicate that one wafer has enough devices to construct an array of 16 SIMD-programmable processors and 25 shared memories. The memory array can store two images each 128-by-128 pixels. One run of wafers has been fabricated, and these wafers were undergoing testing and restructuring at the time of publication
Keywords :
CMOS integrated circuits; VLSI; computerised picture processing; integrated circuit technology; microprocessor chips; redundancy; 125 mm; 128 pixel; 16384 pixel; 2 micron; Lincoln programmable image-processing wafer; Programmable Image Processor; SIMD-programmable processors; WSI; laser-restructurable; memory array; n-well CMOS process; shared memories; wafer-scale device; CMOS process; Foundries; Laboratories; Pixel; Power supplies; Probes; Silicon; Testing; Very large scale integration; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Wafer Scale Integration, 1990. Proceedings., [2nd] International Conference on
Conference_Location :
San Francisco, CA
Print_ISBN :
0-8186-9013-5
Type :
conf
DOI :
10.1109/ICWSI.1990.63878
Filename :
63878
Link To Document :
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