Title :
First-principles simulation study on the effects of dopants on the cohesion of gold grain boundary
Author :
Chew, Y.H. ; Wong, C.C. ; Bakar, Z. ; Ling, J.
Author_Institution :
Materials & Applications Center, Kulicke and Soffa (S.E.A.) Pte. Ltd., #04¿05 TECHplace II, Block 5002, Ang Mo Kio Avenue 5, Singapore 569871
Abstract :
The effect of dopants on the cohesion of gold grain boundaries was investigated using the first-principles density functional theory of the thermodynamic model of Rice-Wang. Dopants that have a smaller diameter and lower electronegativity than gold are more beneficial on the cohesion of Au grain boundaries, which originate from both mechanical and electronic interaction, with the mechanical effect domineering. Dopants that bring up grain boundary cohesion should increase the ductility of Au wires. The method shows reasonable agreement with existing experimental data on calcium and berryllium-doped Au wires.
Keywords :
Atomic measurements; Bismuth; Bonding; Chemistry; Doping; Gold; Grain boundaries; Grain size; Nickel; Wires;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties, and Interfaces, 2007. APM 2007. 12th International Symposium on
Conference_Location :
San Jose, CA, USA
Print_ISBN :
978-1-4244-1338-6
Electronic_ISBN :
1550-5723
DOI :
10.1109/ISAPM.2007.4419945