Title :
A complete 3D thermal model for fast fuses
Author_Institution :
Gh. Asachi Tech. Univ. of Iasi, Iasi
Abstract :
It is important to know the thermal behaviour of a fast fuse for an optimized design as well as for a right choice of the fuse rating with the aim to protect the power semiconductor device. A 3D thermal model was developed in order to study the temperature distribution at a fast fuse. In this model the thermal behaviour of the fast fuse depends on the design of the fuselink elements, the material parameters and the ambient conditions. It was shown the temperature distribution through all fuselink elements. The simulated temperatures were compared with measured temperatures at defined points on the fuse.
Keywords :
electric fuses; power semiconductor devices; temperature distribution; 3D thermal model; fast fuses; fuselink elements; power semiconductor device; temperature distribution; Equations; Fuses; Geometry; Heating; Power semiconductor devices; Protection; Semiconductor device manufacture; Solid modeling; Temperature distribution; Temperature measurement; 3D thermal model; fast fuse; simulation; temperature distribution;
Conference_Titel :
Electric Fuses and their Applications, 2007. ICEFA 2007. 8th International Conference on
Conference_Location :
Clermont-Ferrand
Print_ISBN :
978-2-84516-363-8
DOI :
10.1109/ICEFA.2007.4419971
