DocumentCode
262077
Title
5.4 Ivytown: A 22nm 15-core enterprise Xeon® processor family
Author
Rusu, Stefan ; Muljono, Harry ; Ayers, David ; Tam, Simon ; Wei Chen ; Martin, Andrew ; Shenggao Li ; Vora, Sujal ; Varada, Raj ; Wang, Eddie
Author_Institution
Intel, Santa Clara, CA, USA
fYear
2014
fDate
9-13 Feb. 2014
Firstpage
102
Lastpage
103
Abstract
The next-generation enterprise Xeon® server processor has 15 dual-threaded 64b Ivybridge cores [1] and 37.5MB shared L3 cache. The system interface includes two on-chip memory controllers, each with two memory channels and supports multiple system topologies. The processor has 4.31B transistors in a high-κ metal-gate tri-gate 22nm CMOS technology with 9 metal layers [2]. The design supports a wide array of product offerings with thermal design power ranging from 40 to 150W and frequencies ranging from 1.4 to 3.8GHz. Fig. 5.4.1(a) shows the processor block diagram. The floorplan (Fig. 5.4.1(b)) is driven by the ring bus routability and latency, as well as the chop requirements to smaller core counts. The cores and associated L3 cache are organized in columns of five, with the ring bus segment embedded. The fully populated die has 15-cores in three columns. The 10-core chop removes the rightmost 3rd column and its dedicated top and bottom IOs. CMOS muxes embedded in the ring bus are programmably operable in a 2-or-3-columns configuration. The 6-core chop removes the 2nd and 4th rows from the 10-core die.
Keywords
CMOS memory circuits; cache storage; microprocessor chips; multiprocessing systems; CMOS muxes; Ivytown; chop requirements; dual-threaded 64b Ivybridge cores; frequency 1.4 GHz to 3.8 GHz; high-κ metal-gate trigate 22nm CMOS technology; memory channels; memory size 37.5 MByte; metal layers; multiple system topologies; next-generation enterprise Xeon server processor; on-chip memory controllers; power 40 W to 150 W; processor block diagram; ring bus routability; ring bus segment; shared L3 cache; size 22 nm; system interface; thermal design power; Arrays; CMOS integrated circuits; Capacitance; Clocks; Program processors; System-on-chip; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
Conference_Location
San Francisco, CA
ISSN
0193-6530
Print_ISBN
978-1-4799-0918-6
Type
conf
DOI
10.1109/ISSCC.2014.6757356
Filename
6757356
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