DocumentCode :
262077
Title :
5.4 Ivytown: A 22nm 15-core enterprise Xeon® processor family
Author :
Rusu, Stefan ; Muljono, Harry ; Ayers, David ; Tam, Simon ; Wei Chen ; Martin, Andrew ; Shenggao Li ; Vora, Sujal ; Varada, Raj ; Wang, Eddie
Author_Institution :
Intel, Santa Clara, CA, USA
fYear :
2014
fDate :
9-13 Feb. 2014
Firstpage :
102
Lastpage :
103
Abstract :
The next-generation enterprise Xeon® server processor has 15 dual-threaded 64b Ivybridge cores [1] and 37.5MB shared L3 cache. The system interface includes two on-chip memory controllers, each with two memory channels and supports multiple system topologies. The processor has 4.31B transistors in a high-κ metal-gate tri-gate 22nm CMOS technology with 9 metal layers [2]. The design supports a wide array of product offerings with thermal design power ranging from 40 to 150W and frequencies ranging from 1.4 to 3.8GHz. Fig. 5.4.1(a) shows the processor block diagram. The floorplan (Fig. 5.4.1(b)) is driven by the ring bus routability and latency, as well as the chop requirements to smaller core counts. The cores and associated L3 cache are organized in columns of five, with the ring bus segment embedded. The fully populated die has 15-cores in three columns. The 10-core chop removes the rightmost 3rd column and its dedicated top and bottom IOs. CMOS muxes embedded in the ring bus are programmably operable in a 2-or-3-columns configuration. The 6-core chop removes the 2nd and 4th rows from the 10-core die.
Keywords :
CMOS memory circuits; cache storage; microprocessor chips; multiprocessing systems; CMOS muxes; Ivytown; chop requirements; dual-threaded 64b Ivybridge cores; frequency 1.4 GHz to 3.8 GHz; high-κ metal-gate trigate 22nm CMOS technology; memory channels; memory size 37.5 MByte; metal layers; multiple system topologies; next-generation enterprise Xeon server processor; on-chip memory controllers; power 40 W to 150 W; processor block diagram; ring bus routability; ring bus segment; shared L3 cache; size 22 nm; system interface; thermal design power; Arrays; CMOS integrated circuits; Capacitance; Clocks; Program processors; System-on-chip; Transistors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
Conference_Location :
San Francisco, CA
ISSN :
0193-6530
Print_ISBN :
978-1-4799-0918-6
Type :
conf
DOI :
10.1109/ISSCC.2014.6757356
Filename :
6757356
Link To Document :
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