DocumentCode :
262102
Title :
6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters
Author :
Erdmann, Christophe ; Lowney, Donnacha ; Lynam, Adrian ; Keady, Aidan ; McGrath, John ; Cullen, Eric ; Breathnach, Daire ; Keane, Denis ; Lynch, Patrick ; De La Torre, Marites ; De La Torre, Ronnie ; Peng Lim ; Collins, Andrew ; Farley, Brendan ; Madden,
Author_Institution :
Xilinx, Dublin, Ireland
fYear :
2014
fDate :
9-13 Feb. 2014
Firstpage :
120
Lastpage :
121
Abstract :
Data converters are required to interface digital processing engines, for example FPGAs, to the real world. Data conversion is typically accomplished using discrete devices that are interfaced to the FPGA using various IO standards. However, exponential growth in bandwidth as a result of increasing channel count and higher sample rate means this IO interface is becoming a limiting factor in the system budget with respect to interconnect complexity and associated power. The integration of flexible data converters with FPGA eliminates this IO cost and also offers a dynamically scalable, power efficient platform solution that addresses diverse application needs. In this paper, we demonstrate an aggregate bandwidth in excess of 400Gb/s using sixteen 16b DAC instances running at 1.6GS/s with an FPGA-to-die interface power of 0.3mW/Gb/s. We introduce a reconfigurable receive system that allows channel count to trade with system sample rate. Specifically, we demonstrate a 500MS/s ADC by interleaving four 125MS/s units.
Keywords :
analogue-digital conversion; digital-analogue conversion; field programmable gate arrays; three-dimensional integrated circuits; ADC; DAC; FPGA die; FPGA-to-die interface power; IO standards; aggregate bandwidth; digital processing engines; heterogeneous 3D-IC; reconfigurable high-performance data converters; reconfigurable receive system; size 28 nm; word length 16 bit; Arrays; Bandwidth; CMOS integrated circuits; Clocks; Field programmable gate arrays; Frequency measurement; Integrated circuit interconnections;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
Conference_Location :
San Francisco, CA
ISSN :
0193-6530
Print_ISBN :
978-1-4799-0918-6
Type :
conf
DOI :
10.1109/ISSCC.2014.6757364
Filename :
6757364
Link To Document :
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