• DocumentCode
    262135
  • Title

    8.6 A full-duplex line driver for Gigabit Ethernet with rail-to-rail class-AB output stage in 28nm CMOS

  • Author

    Hui Pan ; Yuan Yao ; Hammad, Mostafa ; Junhua Tan ; Abdelhalim, Karim ; Wang, Eddie ; Hsu, Robert ; Yu, Jinpeng ; Aziz, Joseph ; Tam, Derek ; Fujimori, Ichiro

  • Author_Institution
    Broadcom, Irvine, CA, USA
  • fYear
    2014
  • fDate
    9-13 Feb. 2014
  • Firstpage
    148
  • Lastpage
    149
  • Abstract
    Gigabit Ethernet PHY (GPHY) transceivers find wide use in SoCs and standalone PHY chips with hundreds of millions of ports shipped every year. Transceiver design has recently focused on power reduction driven by the need for higher port density and throughput with minimum energy and thermal cost. The line drivers that deliver power from a high voltage supply to remote 100Ω differential loads dominate the GPHY power consumption. The supply voltage determined by the transmit amplitude specs (e.g., 2Vppdiff for 1000BASE-T/100BASE-TX Ethernet) does not scale with technology. This paper presents an architecture that enables rail-to-rail full-duplex operation for high voltage efficiency resulting in a 2.5V GPHY driver in 28nm CMOS that saves 24% power from the mainstream 3.3V drivers.
  • Keywords
    CMOS integrated circuits; driver circuits; local area networks; radio transceivers; CMOS; GPHY power consumption; GPHY transceivers; SoC; differential loads; full-duplex line driver; gigabit Ethernet PHY transceivers; on power reduction; rail-to-rail class-AB output stage; rail-to-rail full-duplex operation; resistance 100 ohm; size 28 nm; standalone PHY chips; transmit amplitude specs; voltage 2.5 V; CMOS integrated circuits; Mirrors; Solid state circuits; Standards; System-on-chip; Topology; Transceivers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
  • Conference_Location
    San Francisco, CA
  • ISSN
    0193-6530
  • Print_ISBN
    978-1-4799-0918-6
  • Type

    conf

  • DOI
    10.1109/ISSCC.2014.6757376
  • Filename
    6757376