• DocumentCode
    2621922
  • Title

    The Software Breadboard Technique of Virtual Instrument

  • Author

    ZheMin, Chen ; Lingsong, HE

  • Author_Institution
    Sch. of Mech. & Electr. Eng., Kunming Univ. of Sci. & Technol., Kunming, China
  • Volume
    7
  • fYear
    2009
  • fDate
    March 31 2009-April 2 2009
  • Firstpage
    585
  • Lastpage
    589
  • Abstract
    To assemble virtual instrument applications by prefabricated blocks, a software breadboard is proposed. The idea is borrowed from the breadboard that is used in the circuit. In the method, pipelines are defined as the software wires and pipeline components are defined as the software ICs. When pipeline components are linked together by pipelines, they can form a system automatically, which is driven by data streams in pipelines. In this way, a software breadboard of virtual instrument can be realized and it can be used to assembling virtual instrument applications by plugging software ICs onto it. To record the assembling procedure of virtual instrument applications on the software breadboard, a XML script language is also proposed in the paper. At last, the software breadboard, the XML script interpreter and software ICs are integrated together to form a virtual instrument IDE, which can be used to assemble virtual instrument applications.
  • Keywords
    XML; object-oriented programming; program interpreters; virtual instrumentation; IDE; XML script language; assembling procedure; data stream; interpreter; pipeline component; software IC; software breadboard technique; software wire; virtual instrument; Application software; Assembly; Circuits; Computer displays; Computer science; Instruments; Pipelines; Signal generators; Signal processing; XML; XML; breadboard; component; virtual instrumente;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computer Science and Information Engineering, 2009 WRI World Congress on
  • Conference_Location
    Los Angeles, CA
  • Print_ISBN
    978-0-7695-3507-4
  • Type

    conf

  • DOI
    10.1109/CSIE.2009.180
  • Filename
    5170386