DocumentCode :
2621938
Title :
Design Tradeoffs for Electrothermal Microgrippers
Author :
Mayyas, Mohammad ; Zhang, Ping ; Lee, Woo H. ; Shiakolas, Panos ; Popa, Dan
Author_Institution :
Mech. & Electr. Eng., Texas Univ., Arlington, TX
fYear :
2007
fDate :
10-14 April 2007
Firstpage :
907
Lastpage :
912
Abstract :
Microgrippers based on electrothermal actuation were designed and fabricated using the deep reactive ion etching (DRIE) process with 100mum thick silicon on insulator (SOI) wafer. The design requirements are restricted to basic manipulation tasks such as pick and place, and nonprehensile manipulation. This paper explores several electrothermal end-effectors which have been fabricated for serial and parallel microassembly. The end-effectors include three main building blocks: 1) Integrated and symmetrical actuators of V and U shapes. The symmetrical expansions on Chevron and hot arms allow combination of forward translations that amplify angular motion at the tips of a gripper. 2) A joule heating element based on a resistive V-shape electrothermal actuator. In 3D microassembly, the joining of a micropart is essentially performed by providing an integrated microheater device. 3) A force or position feedback sensing block based on self-straining or electrostatic principle. The integrated sensor can be calibrated for both position and force measurements. Serial heterogeneous assembly of meso and micro-scale objects is demonstrated using a 3D microassembly station. Black-box dynamical models for microgrippers are derived using experimentally obtained data, and performance variations due to the way the microgrippers are mounted onto the robot are discussed.
Keywords :
end effectors; force control; grippers; micromanipulators; position control; silicon-on-insulator; sputter etching; 100 micron; 3D microassembly; SOI wafer; blackbox dynamical models; deep reactive ion etching; electrothermal actuation; electrothermal end-effectors; force feedback; joule heating element; microgrippers; position feedback; silicon on insulator wafer; Actuators; Arm; Electrothermal effects; Etching; Force feedback; Grippers; Heating; Microassembly; Shape; Silicon on insulator technology;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Robotics and Automation, 2007 IEEE International Conference on
Conference_Location :
Roma
ISSN :
1050-4729
Print_ISBN :
1-4244-0601-3
Electronic_ISBN :
1050-4729
Type :
conf
DOI :
10.1109/ROBOT.2007.363101
Filename :
4209205
Link To Document :
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