Title :
11.7 A 240mW 16b 3.2GS/s DAC in 65nm CMOS with <-80dBc IM3 up to 600MHz
Author :
Van de Vel, Hans ; Briaire, J. ; Bastiaansen, Corne ; Van Beek, Peter ; Geelen, Govert ; Gunnink, Harrie ; Yongjie Jin ; Kaba, Mustafa ; Luo, Kang ; Paulus, Edward ; Pham, Binh ; Relyveld, William ; Zijlstra, Peter
Author_Institution :
Integrated Device Technol., Eindhoven, Netherlands
Abstract :
Advanced wireless cellular infrastructure systems require DACs with high spectral purity over a wide bandwidth and which are fit for integration of multiple transmit channels with DSP. This calls for IM3 linearity better than -80dBc up to high frequencies and low power dissipation. In this paper, a high-speed current-steering DAC is reported that combines low power and high linearity, enabled by a 3-dimensional sort-and-combine (3D-SC) calibration technique, CML switch-driving circuitry, and switch cascoding. It achieves similar linearity at significantly reduced power compared to a state-of-the-art high-linearity DAC [1] while its IM3 performance is more than 10dB better than the multi-GS/s low-power DAC in [2]. The 16b 3.2GS/s DAC is implemented in a 65nm CMOS process and achieves -80dBc IM3 up to 600MHz while dissipating 240mW from 1.2V and 3.3V supplies.
Keywords :
CMOS digital integrated circuits; calibration; cellular radio; digital-analogue conversion; low-power electronics; switching convertors; 3-dimensional sort-and-combine calibration technique; CML switch-driving circuitry; CMOS process; D-SC; DSP; IM3 linearity; advanced wireless cellular infrastructure systems; high spectral purity; high-linearity DAC; high-speed current-steering DAC; low power dissipation; multiple transmit channels; power 240 mW; size 65 nm; switch cascoding; voltage 1.2 V; voltage 3.3 V; word length 10 bit; CMOS integrated circuits; Calibration; Current measurement; Linearity; Measurement uncertainty; Switches; Three-dimensional displays;
Conference_Titel :
Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014 IEEE International
Conference_Location :
San Francisco, CA
Print_ISBN :
978-1-4799-0918-6
DOI :
10.1109/ISSCC.2014.6757402