DocumentCode :
2622166
Title :
Modeling multilayered PCB power-bus designs using an MPIE based circuit extraction technique
Author :
Shi, Hao ; Fan, Jun ; Drewniak, James L. ; Hubing, Todd H. ; Van Doren, Thomas P.
Author_Institution :
HP-EESof Div., Hewlett-Packard Co., Santa Rosa, CA, USA
Volume :
2
fYear :
1998
fDate :
24-28 Aug 1998
Firstpage :
647
Abstract :
A circuit extraction tool (CEMPIE) has been developed based on the mixed-potential integral equation (MPIE) using a quasi-static approximation. A power-bus in a multi-layered PCB consisting of a pair of dedicated ground and power planes is studied using this tool. The distributed behavior of a power-bus is represented by a collection of passive circuit elements, which is valid up to several gigahertz. The decoupling performance of a power-bus due to its layer spacing and the dielectric constant is evaluated for simple test geometries. The impact of the relative distance between the noise source and the potential receiver is also studied. Novel structures such as a power island were studied in both thin and thick boards, and the decoupling performance due to the locations and values of the decoupling capacitors were also investigated
Keywords :
circuit analysis computing; equivalent circuits; integral equations; permittivity; printed circuit design; MPIE based circuit extraction technique; circuit extraction tool; decoupling capacitors; decoupling performance; dedicated ground planes; dedicated power planes; dielectric constant; layer spacing; mixed-potential integral equation; multilayered PCB power-bus designs; noise source; passive circuit elements; potential receiver; power island; power-bus; quasi-static approximation; test geometries; Admittance; Boundary conditions; Circuit noise; Circuit testing; Conductors; Geometry; Green´s function methods; Integral equations; Passive circuits; Transmission line matrix methods;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 1998. 1998 IEEE International Symposium on
Conference_Location :
Denver, CO
Print_ISBN :
0-7803-5015-4
Type :
conf
DOI :
10.1109/ISEMC.1998.750273
Filename :
750273
Link To Document :
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