DocumentCode :
2623050
Title :
Simulation of self-heating in advanced high-speed SiGe bipolar circuits using the temperature simulator TESI
Author :
Pfost, Martin ; Lachner, Rudolf ; Li, Hao
Author_Institution :
Infineon Technol. AG, Munich, Germany
fYear :
2004
fDate :
8-10 Sept. 2004
Firstpage :
95
Lastpage :
98
Abstract :
Advanced SiGe bipolar technologies now allow the realization of very-high-speed IC such as 40 Gbit/s multiplexers and 77 GHz automotive radar VCO, even if high output power levels are required. However, in such circuits self-heating often leads to high peak temperatures. This can decrease transistor performance and circuit lifetime and must, therefore, be considered during circuit design. In this paper we demonstrate how the temperature increase resulting from self-heating can be accurately determined already in the design phase. For this, we present the experimentally verified three-dimensional numerical temperature simulator TESI that was specifically developed for such problems. It is shown how this tool can be applied to investigate practical circuits using the core of a 40 Gbit/s power multiplexer and the buffer stage of a 77 GHz VCO with high output power as examples.
Keywords :
Ge-Si alloys; bipolar integrated circuits; buffer circuits; circuit simulation; network synthesis; road vehicle radar; switching circuits; temperature distribution; very high speed integrated circuits; voltage-controlled oscillators; 40 Gbit/s; 77 GHz; Ge-Si; SiGe; TESI temperature simulator; VCO; automotive radar; buffer stage; circuit design; high-speed bipolar circuits; power multiplexer; self-heating simulation; temperature increase; three-dimensional numerical temperature simulator; very-high-speed IC; Automotive engineering; Bipolar integrated circuits; Circuit simulation; Germanium silicon alloys; Multiplexing; Power generation; Radar; Silicon germanium; Temperature; Voltage-controlled oscillators;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Silicon Monolithic Integrated Circuits in RF Systems, 2004. Digest of Papers. 2004 Topical Meeting on
Print_ISBN :
0-7803-8703-1
Type :
conf
DOI :
10.1109/SMIC.2004.1398176
Filename :
1398176
Link To Document :
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