DocumentCode
2623142
Title
Prediction of differential- and common-mode noise in high-speed interconnects with the partial element equivalent circuit technique
Author
Pinello, William P. ; Cangellaris, Andreas C. ; Ruehli, Albert
Author_Institution
Pacific Numerix Corp., Scottsdale, AZ, USA
Volume
2
fYear
1998
fDate
24-28 Aug 1998
Firstpage
940
Abstract
Because of its ability to model heterogeneous systems involving both lumped circuit elements and distributed electromagnetic components, the partial element equivalent circuit method is ideally suitable for physical model complexity reduction of large, dense interconnect systems. This paper explores the opportunities arising from this capability in the context of the electromagnetic analysis of interconnect- and package-induced signal distortion and radiated emissions. In particular, emphasis is placed on the implementation within the partial element equivalent circuit modeling framework of transmission line models for coupled interconnects. It is shown that the accuracy of such modeling is dependent not only on whether the interconnects are balanced, but also on the type of noise interaction that is under investigation
Keywords
electromagnetic compatibility; electromagnetic interference; equivalent circuits; integrated circuit interconnections; integrated circuit packaging; lumped parameter networks; transmission line theory; common-mode noise prediction; coupled interconnects; differential-mode noise prediction; distributed electromagnetic components; electromagnetic analysis; high-speed interconnects; lumped circuit elements; modelling accuracy; partial element equivalent circuit technique; radiated emissions; signal distortion; transmission line models; Circuit noise; Coupling circuits; Distortion; Distributed parameter circuits; Electromagnetic analysis; Electromagnetic modeling; Electromagnetic radiation; Equivalent circuits; Integrated circuit interconnections; Packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 1998. 1998 IEEE International Symposium on
Conference_Location
Denver, CO
Print_ISBN
0-7803-5015-4
Type
conf
DOI
10.1109/ISEMC.1998.750334
Filename
750334
Link To Document